To simulate the long gold wire and large bond pad, an equivalent method was presented in thermal analysis.

为了用较小的规模模拟相对较长的金线和较大的焊盘，提出了一种温度场分析的等效方法。

youdao

Both a passivation layer (18) and a polyimide layer (22) separate the last interconnect layer (16) and the bond pad (28).

钝化层(18)和聚酰亚胺层(22)将最后的互连层(16)和接合焊盘(28)隔开。

youdao

The bond pad (28) is then formed in contact with the barrier (26), and a wire bond (30) is then made to the bond pad (28).

随后形成接合焊盘（28）以接触阻挡（26），且随后对接合焊盘（28） 完成线接合（30）。

youdao