With the Cu/Al/Cu compound interlay,the segregation of SiC particles in the bond interface was successfully avoided,and the formation mechanism of joint improved.
采用Cu/Al/Cu复合层,成功避免了连接界面SiC颗粒的偏聚,改进了接头形成机制。
参考来源 - SiC颗粒增强LD2复合材料的真空扩散焊·2,447,543篇论文数据，部分数据来源于NoteExpress
Configure the bond interface and bring it up: ifconfig bond0 ip_address netmask netmask broadcast bcast.
配置并启动bond接口：ifconfig bond0 ip_address netmask netmask broadcast bcast。
The numerical results show that Bar-scale model with radial elastic modulus of bond interface is significant for the radial performance or not for the axial performance.
而对于筋材轴向的计算结果，粘结界面的径向弹性模量影响较小。
The real contact area of the bond interface and the cross-sectional deformation of the bond wire were the causations respectively for the fluctuation and wholly increase of the resistance.
接头界面有效连接面积和接头上引线横截面变形量的变化分别是造成接头电阻波动性和整体增大趋势的原因。
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