Failure of blind via is one of the main causes of an open circuit in printed circuit board(PCB).
盲孔开裂是导致印制电路板（PCB）电气断路的主要原因之一。
The matellization process of blind via or though hole is also achieved by means of copper electroplating.
盲孔或通孔的属化制程也是直接用电镀的方式完成。
Your adversaries know this, and that is why most attacks are now carried out via POST requests, rendering your systems blind.
你的对手很清楚这一点，所以很多时候的攻击是通过POST请求产生，并导致您的系统失明。
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