The invention relates to an adhesive film composition for assembly of semiconductor, an adhesive film and scribing crystal particle binding film.
本发明涉及一种半导体装配用胶粘剂膜组合物、胶粘剂膜以 及划片晶粒粘结膜。
Composition: 90% faux neoprene, 4% PVC film, 6% polyester binding.
成分：90%人造氯丁橡胶，4%聚氯乙烯薄膜，6%涤纶装订。
Binding consumables: plastic wire, double wire, iron spiral wire, plastic index film and so on.
装订耗材：胶线圈，双线圈，铁单线圈，胶索膜等。
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