Two final production assembly line , 30-worker-location hand-soldering line , BGA rework equipment imported from U.
两条手工插装及焊接生产线，可满足客户大批量焊接生产。
Solder Robert, BGA rework station, Automatic Glue dispenser, Video Microscope, Fume absorber, Soldering station, Solder pot, Ultrasonic cleaner, Cable tester, etc.
焊接机器人、BGA返修台、自动点胶机、视频显微镜、吸烟系统、焊台、锡炉、超声波清洗器。网络测试工具等。
Laser bumping is advantageous for its flexibility especially when used for individual solder ball rework and small or medium production of BGA packages, yet it hasn't been vastly applied presently.
激光植球的优势在于它的柔性，它适宜于中小批量BGA的生产与个别焊球的修复，不过目前还没有投入大规模的应用。
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