In order to predict failure location of BGA lead-free solder joints under a drop impact, ABAQUS software is used to analysis stress distribution of the solder joints.
为了预测跌落碰撞下球栅阵列(BGA)封装中无铅焊点的失效，采用ABAQUS软件来模拟跌落碰撞过程中焊点的应力分布。
Two final production assembly line , 30-worker-location hand-soldering line , BGA rework equipment imported from U.
两条手工插装及焊接生产线，可满足客户大批量焊接生产。
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