Northrop Grumman is responsible for systems engineering, system integration, the beam control subsystem, the power subsystem, the thermal subsystem and C3I.
诺斯罗普·格鲁曼公司负责系统工程、系统集成、光束控制子系统、电源子系统、热子系统以及C3I。
Shape memory alloy wires can increase the critical temperature of the beam, and also can restrain thermal buckling occurring or make the post-buckled beam back to initial equilibrium states.
形状记忆合金丝还能提高梁的热屈曲临界温度，抑制梁热屈曲的发生或使已发生热屈曲的梁回复到原来的平衡状态。
This is achieved by using a unique multi beam technology, demonstrated in figure 2, which reduces the power density, minimizes the thermal load, and reduces the kerf width in the wafer.
这是采用独特的多光束技术实现的，图2显示了其工作原理，降低了功率密度，减小了热负载，缩小了刻线宽度。
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