This thesis study the simulation of electromagnetic field of MB chip and two key fabrication processes—fabrication of planar electromagnetic devices based on UV-LIGA and polymeric microfabrication.
本论文研究了磁珠芯片中的电磁场模拟分析，以及两种关键工艺——基于UV-LIGA的平面电磁器件制作工艺和塑性材料微加工制作工艺。 在此基础上，设计、制作并封装了新型磁珠微芯片。
The characteristics and requests of micromachining for silicon based sensors are introduced. The conventional methods of si substrate microfabrication are briefly described.
叙述了硅基传感器微机械加工的特点和要求，简要说明了硅衬底微细加工的常用方法。
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