Research status of laser reflow on solder bump forming of area array packages are introduced, and experimental analysis on laser reflow of PBGA solder ball is performed.

介绍了激光重熔在面阵列封装钎料凸点成形中的研究进展，并且对PBGA共晶钎料球激光重熔进行了工艺研究。

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Laser bumping is advantageous for its flexibility especially when used for individual solder ball rework and small or medium production of BGA packages, yet it hasn't been vastly applied presently.

激光植球的优势在于它的柔性，它适宜于中小批量BGA的生产与个别焊球的修复，不过目前还没有投入大规模的应用。

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Furthermore, the effect of solder ball layout and stress relax buffer layer material on the fatigue life of solder joints is studied.

最后探测锡球配置方式和缓冲层材料性质对于锡球疲劳寿命的影响，以获得高可靠度的封装结构。

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