In this study, the computational fluid dynamics approach is employed to analyze the heat transfer for ball grid array package that is popular in modern electronic industry.

本研究以计算流体力学的方法，对电子构装产品的明日之星- - -球栅阵列封装方式，来进行详细的热传分析。

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The part is available in a 32-lead lead frame chip scale package (LFCSP), and a 25-ball wafer level chip scale package (WLCSP).

该器件提供两种封装：32引脚架构芯片级封装（LFCSP）和25引脚晶圆级芯片规模封装（WLCSP）。

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Because the school knows that the family is locked into that place if the child is accepted, the school can low-ball the financial aid package that accompanies the acceptance letter.

FORBES: College Admission's Best Kept Secret

Fiji have been the surprise package of the competition but got off to the worst possible start against the Kangaroos, losing the ball on the second tackle of their first set of six with just 21 seconds gone.

BBC: Australia 52-0 Fiji