And finally it introduces two effective methods to control backside chipping: Stress Relief Step Cutting and Dicing Before Grinding.
同时介绍了两种控制背面崩裂较有效的切割工艺:减少应力的开槽切割工艺和DBG工艺。
·2,447,543篇论文数据，部分数据来源于NoteExpress
The dicing kerfs have been reduced to below 20 um in many cases, with no chipping on either front or backside.
在很多情况下，刻划宽度可以小到20um，上下都没有碎屑。
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