Method of semiconductor wafer back processing, method of substrate back processing, and radiation-curable pressure-sensitive adhesive sheet.
半导体晶圆背面加工方法，衬底背面加工方法，和辐射固化型压敏粘着片。
Because of the reflection on the back surface the minority carrier generation and illuminated surface photovoltage of both sides polished wafer will be higher than one of single side polished wafer.
由于背抛光面对受光面入射光的反射，使得少子产生率和受光面表面光电压都高于单面抛光片。
The front and back of typical CMP rings may separate under high pressure and rotation, which can damage the wafer.
在高压和高速旋转下，传统的CMP环可能会分离开来，从而会损坏晶圆。
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