IC Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production.

集成电路粘片机是将半导体晶圆上微芯片贴装到引线基架的半导体制造后工序关键性生产设备。

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It has no back end repository to query against and is not enabled for production environments, but it is useful for simple test scenarios with staff support.

它没有用来查询的后端存储库，并且不支持生产环境，但对于具有人员支持的简单测试场景非常有用。

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For production code, validating and transforming textual input is better handled by back-end code (a servlet, for example), rather than by means of JSP custom tags.

对于生产代码，文本输入的验证和转换最好由后端代码(比如servlet)来处理，而不是通过jsp定制标记来处理。

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In that case, restocking on the back of a recovery in end-user demand should support a rebound in industrial production and the PMIs in March, if all goes swimmingly well.

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