2D interconnect analysis 二维互连线分析
grey interconnect analysis 灰关联分析
d interconnect analysis 二维互连线分析
vlsi interconnect analysis vlsi互连线分析
2 d interconnect analysis 二维互连线分析
grey interconnect degree analysis 灰关联分析
VISI interconnect and package analysis WSI互连与封装分析
Based on differential quadrature method (DQM), a new method for sensitivity analysis of response waveforms of interconnect lines is proposed.
提出一种基于微分求积法、对互连线的响应波形进行灵敏度分析的新方法。
Because vertical via interconnect is the base of theoretical analysis and package technics of MMCM, further study on vertical via interconnect is very vital and instructive to reality.
垂直通孔互连是微波多芯片组件封装工艺和理论分析的基础，开展垂直通孔互连的研究有着现实的意义。
Presents a architectural design of a high performance ATM switch based upon theoretic analysis, the mode of multi level interconnect of spread module and small switching module used.
在理论分析的基础上提出了一个大容量AT M交换机的结构设计方案，采用扩展模块和小交换模块多级互连方式实现了交换机大容量设计的目的。
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