Full Ag Plating 表面整体镀银
Partial Ag Plating 局部镀银
chemical ag plating 化学镀银
electroless Cu-Ag plating 化学镀铜银
continuous high speed ag plating 连续高速镀银
plating Ag 镀银
Rare earth improved electroless plating method was developed for simultaneously depositing Pd-Ag alloy film on ceramic support.
采用稀土改进的化学镀法在多孔陶瓷载体上共沉积钯-银合金膜。
MOVABLE BLADE: Stainless Steel, Ag over Ni plating.
动刀：不锈钢，对镍银电镀。
More attention was focused on the effects of osmosis on the deposition speed, compositions, surface structure properties of the simultaneously deposited Pd-Ag alloy top layer by electroless plating.
重点研究了渗透压对化学镀共沉积钯银的沉积速度、镀层组成和膜表面结构性能的影响。
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