Each pellet is mounted on an adhesive sheet with wire-bonded electrode side up.

每粒晶片键合电极面朝上装在粘性膜上。

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Expansion extrusion molding, extrusion molding apparatus therefor, and process for producing pressure-sensitive adhesive sheet.

膨胀挤出模塑，采用该法的挤出模塑装置，及用于制备压敏粘合剂片材的方法。

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Method of semiconductor wafer back processing, method of substrate back processing, and radiation-curable pressure-sensitive adhesive sheet.

半导体晶圆背面加工方法，衬底背面加工方法，和辐射固化型压敏粘着片。

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