The results show that there is not any evidence of silver migration within LTCC construction, and conductor adhesive force, wire-bonding strength and insulation resistance are high.
结果表明：基板内部的银导体不存在迁移现象，导体的附着力、键合强度以及基板的绝缘电阻等性能均比较理想。
Many adhesive proteins contain the Arg Gly Asp (RGD) sequence which plays an important role in cell adhesion, migration and growth.
RGD是许多粘附蛋白所共有的高度保守氨基酸序列，这一序列在介导细胞粘附、迁移及生长方面起重要作用。
The cell form was observed by light invert microscope. The adhesive and invasive ability was detected by cell adhesion and migration experiments.
以细胞迁移实验和粘附实验观察细胞侵袭和粘附能力的影响。
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