The bonding strength is ensured by the correct choice of substrate material, surface preparation, adhesive and process parameter.
粘合强度可以通过选择正确的基体材料、表面处理、胶粘剂和工艺参数得以保证。
The influences of surface treatments, the pressures during bonding process and the thickness of adhesive layer on shearing strength were investigated with epoxy resin-DDS curing system as adhesive.
采用环氧树脂- DDS固化体系作为胶接剂,探讨了各种金属表面处理方法、胶接时对胶接面施加的压力、胶层厚度等因素对胶接剪切强度的影响。
The process of FPC mount is fixing the components to FPC, by means of adhesive bonding, welding, etc.
FPC贴装过程就是通过胶剂黏合或焊接等方法,将元器件固定到FPC上的过程。
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