Cholride ions in acid copper plating bath were determined by nephelometry with OP emulsifier as stabilizer.
利用比浊法 ,以OP乳化剂作为稳定剂测定酸性镀铜液中的氯离子。
参考来源 - 比浊法测定酸性镀铜液中的氯离子·2,447,543篇论文数据，部分数据来源于NoteExpress
Is the copper plating process an electrolytic acid copper plating system?
电镀站是否有酸解电镀铜系统？
Cholride ions in acid copper plating bath were determined by nephelometry with op emulsifier as stabilizer.
利用比浊法，以OP乳化剂作为稳定剂测定酸性镀铜液中的氯离子。
The influences of the intermediate and monomer brighteners commonly used in present acid copper plating on…
本文主要对目前国内外常见的酸性镀铜中间体、单体光亮剂对硬度的影响进行了测试研究。
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