介绍了微电子镀覆在半导体和IC封装、凸点制作、多芯片组件以及微电子机械系统中的应用。
This article describes the application of microelectronic plating in manufacture of semiconductor, IC packaging, micro-bumps, multichip modules and microelectronics mechanical systems.
详细阐述了CSP的几项主要的关键技术：即结构设计技术，凸点制作技术，包封技术和测试技术。
We particularly expatiated some key technology about CSP: structure designing technology, Solder Bumping making technology, envelopment technology, testing technology.
该小组率先使用胶体量子点制作太阳能电池，一种能够容易调整，对可见及不可见光谱中特定波长进行反应的纳米材料。
The team pioneered solar cells made using CQD, nanoscale materials that can readily be tuned to respond to specific wavelengths of the visible and invisible spectrum.
应用推荐