电路板基板材料主要以高分子树脂为主，是典型的黏弹性材料。
Main materials of printed circuit board (PCB) substrate were macromolecule resins, which were typical viscoelatic materials.
建立了以油藏隆起为尖楔嵌入非线性黏弹性材料的界面断裂力学模型。
Here, an idealized interface fracture model was established in which the reservoir hunch as an elastic wedge was embedded in nonlinear viscoelastic material.
杨晓莲，姜贵云，徐丽丽，刘亚梅黏弹性材料玻璃酸钠关节腔填充治疗髌骨软化症的安全性评价。
Yang X. -L. , Jiang G. -Y. , Xu L. -L. , Liu Y. -M. Safety evaluation of intra-articular sodium hyaluronate for the treatment of chondromalacia patellae.
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