在圆片规模上开始加工，结束于芯片规模的圆片级封装技术将在面型阵列倒装芯片的封装中得到日益广泛的应用。
The WLP technology that initiates processing from Wafer-Level and finishes in chip scale will be applicable on a daily broadening scale in plane array FCP.
为提高自由曲面型面加工精度，提出了在计算机控制光学表面成型工艺中基于压力控制的抛光修正方法。
A method is developed for correcting the accuracy of non rotating and aspherical lens by controlling the pressure of the polishing die during computer controlled optical surfacing (CCOS).
基于体硅微加工技术设计并制作了一种新型的采用静电驱动的连续面型可变形反射镜。
A novel electrostatic actuated deformable mirror with continuous facet is designed and fabricated by using silicon bulk micromachining technology.
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