介绍基于SOPC设计非致冷红外焦平面热成像电路单元的方法，并对电路的结构进行了分析。
In this paper the designing principle of UFPA imaging circuit based on SOPC is discussed, and the structure of UFPA imaging circuit is analyzed.
根据处于脉冲偏置的红外热像仪的成像过程，分析了影响非致冷热像仪NETD的几个因素。
Several factors that affect the accuracy of noise equivalent temperature difference(NETD)are demonstrated according to the equation of NETD of the infrared imager under pulse bias.
高密度、低成本的非致冷凝视焦平面阵列的出现使红外热成像技术发生了第三次变革。
The technology of staring uncooled infrared focal plane arrays (UFPA) with high-density and low-cost is the third breakthrough in the developing of infrared imaging technology.
应用推荐