集成电路粘片机是将半导体晶圆上微芯片贴装到引线基架的半导体制造后工序关键性生产设备。
IC Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production.
本发明涉及多层介电结构的生产并涉及包含这些结构的半导体设备和集成电路。
The invention relates to the production of multilayered dielectric structures and to semiconductor devices and integrated circuits comprising these structures.
将MAXIM公司生产的充电专用集成电路MAX713与单片机相结合，设计快速充放电设备，是现今充放电系统设计的主流。
Combining the specialized IC- MAX713 produced by MAXIM with MCU, to design quick charge & discharge device is the main trend of designing charge & discharge system.
应用推荐