采用适当的电镀技术诸如阳极化和附加阴极技术可以控制镀层的厚度和范围。
Proper use of special plating techniques, such as conforming anodes and robbers, can control plating thicknesses and runouts.
本发明解决了传统工艺在碳纳米管表面难以形成完整连续镀层及镀层厚度不易控制的问题。
The invention solves the problems that complete and continuous plating is difficult to form on the carbon nano tube surface and the plating thickness is not easy to control in the tradition technique.
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