采用统计过程控制(SPC)技术，提高微电路产品的质量和可靠性，监控键合工序的生产过程状态。
Statistical process control (SPC) technique is used to improve quality and reliability of microelectronic products, and monitor production conditions of wire bonding process.
本文简要描述了陶瓷外壳封装集成电路自动铝丝楔焊键合的工序检查。
This paper simply described the process inspection of automation Al wire ultrasonic wedge bonding in ceramic packaging IC.
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