金属铜的电阻率低，所以在印制电路板中，用来制备铜箔及双面板、多层板的孔金属化方面采用镀铜工艺。
The resistance of the copper rate is low, so in printed circuit board, used to prepare copper foil and double panel, produce multilayer prototypes via metallization copper with on the process.
提出了一种具有自由悬浮敏感膜和带孔铜底板的硅微机械电容式麦克风。
A micromachined condenser microphone with a free floating sensing diaphragm and a perforated thick copper backplate is presented.
理论分析和实验研究表明，用型孔轧制法制备钛铜复合棒的工艺是可行的，并且也是较好的一种复合方法。
Theory analysis indicate with experiment research, prepare against with pass rolling to prepare titanium copper cladding bar excellent craft feasible, and a kind of better complex methods.
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