结果表明，仰孔的排水效果明显优于铅孔。

Result shows that drainage effectiveness of upward hole has an obvious advantage over that of plumb hole.

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通孔盘状及平面阵列陶瓷多层电容器焊料所含的铅。

Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors.

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本文对空调器印刷电路板(PCB)通孔插装形式无铅焊点的热疲劳寿命进行了研究。

Thermal fatigue life of lead-free solder joint of Air-conditioner PCB (Printed Circuit Board) under the form of THT (Through Hole Technology) is studied.

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