固定图案金属化 fixed pattern metallization
Laminar flow of immiscible flow and metal patterning.
五.不互溶液体层流及金属图案化。
参考来源 - 微流控芯片中层流现象的研究与应用·2,447,543篇论文数据，部分数据来源于NoteExpress
本实用新型公开一种多芯片封装结构，至少包括一承载器、至少一封装模块、一绝缘层及一图案化金属层。
The utility model discloses a multi-chip packaging structure comprising at least a loader, at least a packaging module, an insulation layer and a pattern metal layer.
图案化金属层位于绝缘层上并填入于导通孔中，以作为本实用新型多芯片封装结构的内连线层。
The pattern metal layer is arranged on the insulation layer and filled into the diversion holes, thereby being an inner linking layer of the multi-chip packaging structure of the utility model.
在外壳上用油墨印刷各种花色图案的金属化塑料薄膜层直接粘贴上，完成了外壳的装饰作用。
The outer casing is pasted with a metallizing plastic film layer with various colors and patterns printed by ink to accomplish the decorative effect of the outer casing.
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