下金属化层 under bump metallization
多层金属化 multilayer metallization ; mlm ; multiple layer metallization
双层金属化 double level metallization ; two level metallization ; level metallization
镍锡金属化层 Nickel-tin metallizing contact
焊球下金属化层 UBM
器件端头金属化层 terminal metallization of component
金属和氧化物镀层 Metallic and oxide coatings
金属背部钝化层 backside passivation
多层金属化聚酯膜电容 Multilayer Metallised Polyestern Film
为提高陶瓷金属化层的焊接性能，提出了一种陶瓷二次金属化镀镍工艺。
In view of the poor solderability of metallic film formed on ceramic surface, a secondary metallization of ceramic surface by nickel plating was advanced.
另外在金属化层(2)和金属最终层(4)之间可提供金属粘结层(3)。
In addition, a metallic adhesive layer (3) can be provided between the metallizing layer (2) and the metallic final layer (4).
局部放电现象会给金属化有机薄膜电容器的金属化层、介质及喷金端面产生不良影响，影响电容器寿命。
Local discharging would damage the metallized layers, dielectrics and metal-coating terminals of the metallized film capacitors; therefore, reduce their life.
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