... Matte Copper Plating 铜电镀 ; 雾铜电镀 Acid Copper Plating 酸性镀铜 copper plating brightener 镀铜光亮剂 ...
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Cholride ions in acid copper plating bath were determined by nephelometry with OP emulsifier as stabilizer.
利用比浊法 ,以OP乳化剂作为稳定剂测定酸性镀铜液中的氯离子。
参考来源 - 比浊法测定酸性镀铜液中的氯离子·2,447,543篇论文数据，部分数据来源于NoteExpress
生产上常用的镀铜工艺有氰化镀铜、酸性镀铜、焦磷酸盐镀铜等。
Production of copper plating technology commonly used by a copper with copper with coke, acid, phosphate copper with etc.
利用比浊法，以OP乳化剂作为稳定剂测定酸性镀铜液中的氯离子。
Cholride ions in acid copper plating bath were determined by nephelometry with op emulsifier as stabilizer.
用EDTA作显色剂，通过光度法测定酸性镀铜液中硫酸铜的含量。
Copper sulfate in acid copper plating bath was determined by spectrophotometry with EDTA as chromogenic agent.
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