适当提高锯丝的张紧力，在一定的变化范围内，采用高的锯丝速度和低的进给速度，可以获得好的切片表面质量。
Increasing the wire tension force properly, adopting the higher wire velocity and slower infeed velocity in a range, the high wafer surface quality can be obtained.
在本试验参数范围内选取切削参数时，切削速度、进给量取中值有利，切削深度取小值有利。
At the range of the testing parameters it is of advantage to select middle value of feedrate and cutting speed, and smaller value of cutting depth.
计算实例表明，使用这个方法可以缩短插补计算时间，实时性好，插补精度高，进给速度波动范围小。
The simulation calculating shows that, the computing time can be shortened, the real-time operation is good, the interpolation accuracy is higher, and the feed speed is even.
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