本文介绍了抗高过载电路的封装技术与封装材料，对抗高过载电路的封装工艺作了详尽的探讨。
The paper introduces the packaging technology and materials for the anti-high load circuit. It explores the packaging craftsmanship in details.
在这种情况下，就需要附加的过载保护功能以避免损坏仪器的输入电路。
In these cases, additional overload protection is required to avoid damaging the input circuitry of the instrument.
检查电器箱接线及紧固情况，调整延时继电器及过载保护器，接通电路，试验电机转向，选择合适规格的保险丝。
Check the electrical box wiring and tighten the situation, adjust delay relays and overload protector, connect circuits, test motor steering, select the appropriate specifications of the fuse.
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