覆晶技术已成为电子构装中之主要接合技术之一。
Flip chip technology has become one of the major joining technologies in electronic packaging.
摘要覆晶技术已成为电子构装中之主要接合技术之一。
Flip chip technology has become one of the major joining technologies in electronic packaging.
文中主要探讨了覆晶封装底胶充填时，锡球、芯片及基板间的流动状况。
In this paper we report the analysis of underfill encapsulation between the solder ball, micro-chip...
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