表面贴装元件回流可修复不同衬底材料。
Surface Mount Component Reflow repair on various substrate materials.
采用波峰焊工艺可能会对先期焊接的表面贴装元件造成损伤。
The wave soldering process may advance welding on the surface mount components damage.
传统的通孔元件的焊接采用波峰焊或手工焊接。目前电路板上表面贴装元件和通孔元件混合在一起。
Through hole components welding using traditional manual welding or soldering. The circuit board surface mount components and through-hole components mixed together.
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