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表面微加工工艺采用两种晶体硅芯片基板作为赖以建立层的基础，或者可以在更便宜的玻璃或塑料基板启动。
The surface micromachining process uses either crystal silicon chip substrates as a foundation upon which to build layers, or can be started on cheaper glass or plastic substrates.
重点研究了加工单晶材料时晶向对临界切深、微切削力和表面粗糙度的影响；
The crystallographic effects on critical depth, micro cutting forces and surface waviness when machining single crystals are emphatically investigated.
如果刀具参数选取得当，能在常规切削用量下获得在玻璃的塑性域内形成的、无微裂纹的加工表面。
Crack-free surface that is formed in ductile regime of glass can be obtained under conventional cutting conditions if the tool parameters are chosen properly.
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