标准组件筏——也就是安装在浮筒上的平台，被金属件连接在一起，构成了表面可随波浪摆动而略显起伏的巨大平台。
Modular rafts—platforms mounted on pontoons—would be linked together by hinges to create large, flattish surfaces that could nevertheless bend with the waves.
需要离开线路板安装的组件在线路板表面利用引脚形状或其它机械支撑来防止焊盘的翘起。
Components required to be mounted off the board are provided with lead forms at the board surface or other mechanical support to prevent lifting of solder land.
本文介绍了用于高速光电组件的表面安装型焊球阵列（BGA）封装技术。
Surface mount BGA Packaging Technology for high-speed Optoelectronic modules is described in this paper.
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