Progresses achieved were as follows:1、Study on Thermal Conductivity and Viscosity of Low-Melting-Point Binary alloys. Low-melting-point metals are playing increasingly important roles in the field of chip cooling.
本论文旨在对这一课题进行研究,所取得的进展如下:1、二元低熔点合金热物性的研究室温金属流体在芯片散热领域中正日益显示重要价值,但相关材料的热物性比较缺乏。
参考来源 - 计算机热管理中的液体金属散热方法研究·2,447,543篇论文数据，部分数据来源于NoteExpress
这些特性将使这些材料非常适合作为电脑芯片散热材料使用。
This characteristic may make the materials ideal for use in drawing heat away from objects that include computer chips.
最后介绍了计算系统功耗的方法和芯片散热设计的注意事项。
The method for calculating power dissipation and some cautions for thermal design are provided in the end.
微通道热沉是解决高热流密度微电子芯片散热的一种有效途径。
Microchannel heat sink is a promising technique to dissipate high heat flux microelectronic chips in the near future.
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