针对多传感器集成的气象芯片设计中的布局问题，采用有限元方法分析了热风速计工作中产生的热场对气压膜的影响。
Layout design is quite important in multi-sensor integrated weather chips. The influence of the temperature field, induced by thermal anemometer, on pressure sensitive films is analyzed by FEA method.
针对巨型机概念设计需求，在传统芯片级与系统级布局规划方法基础上，提出一种面向并行设计规划的快速布局模型与算法。
Based on the traditional placement methods at VLSI and system level, a novel model and algorithm of rapid system level placement for CDP is presented.
介绍了A SIC芯片设计时存储器的可测性设计方法，以及存储器对布局布线策略的影响。
The design for testability of memory in ASIC design is dealt with and the influence of memory on placement and routing in IC design is analyzed.
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