除了负的热膨胀效应，研究人员也发现了温度改变引起的材料多孔性的明显改变，因而这种多孔性就变得高度可控。

Besides negative thermal expansion, the researchers also found that changes in temperature lead to a significant variation in the porosity of the material, which is therefore highly controllable.

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合成材料具有更好的承载能力，更低的热膨胀系数，更好的耐磨性和更好的抗疲劳性能。

The composite material has resulted in greater load carrying capacity, a reduced thermal expansion, greater wear resistance and fatigue endurance.

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塑封集成电路因其是非气密性封装，封装材料热膨胀系数的不同以及被粘接材料表面能低，是造成塑封电路离层或开裂的内部原因。

First of all, the internal reason for the delamination or cracking is the different CTE of the packaging materials and the low surface energy of the adhesions.

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