器件键合失效主要表现为温度试验后管壳上的键合点脱落，而引起失效的原因与工艺过程和键合所涉及的材料有关。
The wire bonding failure of devices is mainly shown as the breaking off of wire bonded on the packages after temperature test, and the failure causes are related to wire bonding process and materials.
当Tabrizian博士把“穿上新衣服”的红细胞跟抗体放在一起处理的时候，什么也没有发生。而在一般情况下，这些抗体会附着在红细胞上面引起红细胞聚集成簇而失效。
When Dr Tabrizian exposed the newly coated blood cells to antibodies that would normally have been expected to stick to them and cause them to gather in useless clumps, nothing happened.
压力过大会促使密封过早失效，而接触压力过小则会引起泄漏。
Pressure the General Assembly to premature seal failure, and the contact pressure is too small will cause leakage.
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