提高砂带速度、工件转速以及增大砂带磨粒粒度可有效地提高花岗岩的磨削效率。
With the increase of grinding speed or the abrasive grain size of the grinding belt, the grinding rate increases.
基于这种机理，应用微观接触力学和磨粒粒度分布理论建立了一种新的表征CMP过程材料去除速率的数学模型。
Based on this mechanism, a new mathematical model characterizing the material removal rate in CMP process was developed by using micro-contact mechanics and particle size distribution theory.
对超精密磨削所用细粒度金刚石砂轮磨粒粒径的分布特点和砂轮表面上磨粒的轮廓波长进行了分析。
Detailed analyses of the grain size distribution characteristics and the grain profile wavelength of fine diamond grinding wheel used for ultra-precision grinding are presented.
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