这一模型和模拟结果对硅-硅直接键合设计有一定参考价值。
The model and the simulation results can be the reference in design of bonding process.
硅片键合往往与表面硅加工和体硅加工相结合，用在MEMS的加工工艺中。
The silicon bonding technology is generally combined with surface silicon machining and bulk silicon machining in MEMS.
水平驱动光开关采用单层体硅结构，另外两种光开关都采用了硅-玻璃的键合结构。
The first is formed with monolayer bulk silicon structure, the others use the silicon on glass bonding structures.
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