设备可用于半自动或全自动机械工业。可精确设定研磨角度，操作人员也可进行调节。
The machine is available in semi - or fully automatic versions and comes delivered with precision Settings for required grinding angles and can also be adjusted by the operator.
讨论了在检测半导体器件和集成电路芯片时，不同研磨倾斜角度对扩展电阻量值的影响。
The effects of choosing lapping bevel Angle during testing semiconductor devices and LSI chips by spreading resistance technique on measurement accuracy have been investigated in this paper.
从油墨研磨的角度出发，分析油墨研磨过程中压力、水流量、时间因素对研磨出来的油墨质量的影响，进而分析其对胶印印刷品密度的影响。
This paper analyzed the effect of pressure, water flow, and time factors in ink grinding process on the grinding quality of ink, and then analyzed the influence to the offset printing density.
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