研究光纤端面研磨时高质量表面的形成机理已成为提高光纤连接器质量和制造效率的重要课题。
The study on high quality surface formation mechanism in lapping of optical fiber end-face has become an important topic about improving performances of optical fiber connectors.
对压敏电阻的磨片工艺进行了探讨，并提出了一种新的磨片工艺：双端面研磨，采用贯穿送料和连续磨削的方法。
An approach is made on grinding process for varistor and a new dual surface grinding process with through feeding and continuous grinding is proposed.
通过光学研磨、端面切割等手段对光纤端面进行加工，获得平整光洁的光纤端面。
By means of optical grinding and cutting optical fiber end face, it can access clean fiber end face.
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