结果显示，采用有机保护层的焊接界面金属间化合物层厚度明显超过了浸银层；

The thickness of intermetallic compounds (IMC) layer with OSP was higher than that of I-Ag.

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显微硬度测试分析进一步证明了铝合金与镀锌钢界面中心区由硬度高的金属间化合物组成。

Micro-hardness test further demonstrates that interface center of aluminum alloy and galvanized steel is composed of high hardness intermetallic compounds.

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