通过对界面回波和几何回形状回波之间的回波信号评估来分析产品部件，例如工件边缘回波，开孔之类的回波是来自几何形状回波。
The component analysis is carried out by evaluating the flaw indications between the interface echo at sound entry and the indications from the geometry, such as edges – openings – holes.
薄层结构超声测厚过程中，薄层上下界面回波叠加导致信号难以区分。
It is difficult to recognize the overlapping signal of the front and bottom echoes from the thin layer structure.
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