也就是说，在电镀过程中当晶核的生成速度大于晶核的成长速度时，就能获得结晶细致、排列紧密的镀层。

That is, in electroplating process when the generation of the nucleation speed is greater than the growth of the nucleation rate, it can get meticulous, crystallization of closely spaced coating.

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例如，要电镀的注塑件在电镀时会经受酸溶液，必须采用很低的注塑速度制造以使表面方向性最小化。

For example, moldings that are to be electroplated, and will be subject to acid solutions during plating, must be made using very slow injection speeds to minimize surface orientation.

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这些变化都加快了电沉积速度，使高速局部电镀有可能实现。

All these changes enhance electrodeposition rates, thus high-speed selective electroplating can be reached.

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