电镀电流与程序是否符合设计要求？电镀时的ASF范围是多少？谁确定ASF？如何确认？
Do the plating current and program used match the design and traveler? What is the ASF range used during plating? Who determines ASF? How?
这为食品饮料领域的各种滤膜装置（MF，UF，NF，RO，电镀透析）提高了效果和程序效率。
The optimization of cleaning procedures and equipment will improve the performance and efficiency of various membrane filter devices (e. g. MF, UF, NF, RO or Plating dialysis).
我们拥有专利权的设置程序可以进行深腔镀膜，同时在无孔隙的情况下保持电镀厚度。
Our proprietary setup procedures enable us to plate in deep cavities, while maintaining electroform thickness with zero porosity.
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