集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
产品输入，输出的电压高低是根据，联接组别，调节抽头多少，绕组容量分配以及次级单相绕组，净化电路的运用。
Product input and output voltage level is based on, join groups, adjust the number of taps, winding single-phase capacity allocation, and secondary windings, the use of purification circuit.
介绍变频器驱动一用一备负载的自动定时轮换控制电路及组合开关联接。
This paper introduces the automatic control circuit time in turn driven by inverter with the using and the reserved load and combined switch connection.
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